Used for heating elements such as high-power secondary tubes, transistors, silicon controlled components, power amplifier, IC, heating pipe and other heat transfer media between the radiator, so that the heating element and the heat base material contact surface to maximize, to reduce the working temperature of the heating element.

Computer processor CPU, graphics card, LCD and PDP flat panel display, thermistor, chip and chipset.

Yoneng thermal insulation silica gel gasket is suitable for the following product range:

1, used for heating elements such as transistors, silicon controlled elements, power amplifier, IC, heating pipe and radiator between the medium of heat transfer, so that the heating element and heat dissipation base material contact surface maximization,

Reaching the operating temperature to reduce the heating element.

2, computer processor CPU, graphics card, LCD and PDP flat panel display, tablet computers and servers.

3. Heat conduction and heat transfer of automotive electronics, battery heat dissipation, power module and communication equipment.

4, LED lighting, LED lighting equipment, etc.